Rheology of F620 solder paste and flux

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Overview

authors

• David Bento
• David Bento
• Barbosa, F.V.
• Filho, José Teixeira
• Senhorinha Teixeira
• Ana I. Pereira
• Delfim Soares

publication date

• January 1, 2018

published in

• Soldering & Surface Mount Technology  Journal

Research

keywords

• Flux
• Rheology
• Solder paste
• Thixotropy
• Viscosity

Identity

Digital Object Identifier (DOI)

• https://doi.org/10.1108/ssmt-08-2018-0027