Thermomechanical behaviour of bonded joints of wood and wood-based panels at room and elevated temperatures

Wood is a natural material traditionally used in the construction industry. In recent decades, developments in scientific research have turned wood into a high-tech construction material. Increased interest in bonded joints in wood construction is due to the advantages of adhesive technology compared to traditional mechanical joining techniques. It is very important to understand the influence of elevated temperatures on adhesives due to their use in multilayer systems such as compartmentation walls and fire-resistant doors, which require adequate mechanical and thermal resistance in fire situations. The purpose of this study is to investigate the mechanical behaviour of different structural adhesives on bonded connections of wood and wood-based panels at room and elevated temperatures through experimental testing. The performance of the adhesives was evaluated at room temperature and at 50 °C, 100 °C, 150 °C, and 200 °C.

Thermomechanical behaviour of bonded joints of wood and wood-based panels at room and elevated temperatures Conference Paper