Measuring displacement field and detection of unbonded regions in a single lap joint with Moiré intereferometry
Conference Paper
Overview
Overview
abstract
Adhesives are increasingly being used to replace traditional fastening methods in industrial
applications such as welding, bolts and rivets. In cars and other transport applications, weight
reduction is a key factor in new developments, hence the use of lightweight adhesives is rapidly
expanding.
Adhesives are used to bond many different material types including ceramics, metals, glass,
plastics and composites. The key advantages of adhesives include the distribution of loads
across the entire joint area, excellent fatigue properties, attenuation of mechanical vibrations and
noise, sealant functions, reduction in galvanic corrosion between dissimilar metals, and a faster
more cost-effective assembly method.
The goal of this work is the development of an experimental technique to measure the
displacement field and to perform detection of unbonded regions in a single lap joint. The
proposed experimental technique is based on the use of Moiré Interferometry.
The goal of this work is the development of an experimental technique to measure the displacement field and to
perform detection of unbonded regions [1] in a single lap joint [2, 3]. The proposed experimental technique is based on the use
of Moiré Interferometry. It is a field technique that allows in-plane displacement measurements without contact and with high
resolution [4, 5].
